AG16K FPGA devices are targeted to high-volume, cost-sensitive, applications, enabling system designers to meet increasing performance requirements while lowering costs. The device AG16K offers supreme quality, stability, and exceptional pricing value.
Features - High-density architecture with 16K LEs
- Up to 504Kbits of RAM space
- Up to 56 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit multipliers
- Provides 4 PLLs per device provide clock multiplication and phase shifting
- High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL
- SSTL, SSTL-II IO standard, support DDR, DDR2
- Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL
- General package options, LQFP-144, -176 and FBGA-256
- Two 12-bits SarADC (embedded temp sensor)
- Flexible device configuration through JTAG and SPI interface
- Support remote update, by "dual-boot" like implementation
- Support on chip signal debugging
AG16KSDE176/AG16KSDF256/AG16KSDE176G devices are AG16K FPGA bonded with 64MBit 32-bit 166MHz SDRAM : - AG16KSDE176, QFP-176 papckage suppports 2-layer PCB(cost-down) design. AG16KSDE176 is pin-to-pin compatible with AG10KSDE176. - AG16KSDF256, FBGA-256 package supports 152 user IOs and 3 additional ADC IO. - AG16KSDE176G, QFP-176 package suppports 2-layer PCB(cost-down) design, with 139 user IOs.
AG16KDDF256 device is AG16K FPGA bonded with 128MBits 16-bit 200MHz DDR-SDRAM, FBGA-256 package supports 170 user IOs.
AG16K FPGA器件面向大批量,成本敏感型应用,使系统设计人员能够满足不断增长的性能要求,同时降低成本。 设备AG16K 提供了卓越的质量,稳定性和出众的价格。
特征 - 具有16K LE的高密度架构
- 高达504Kbit的RAM空间
- 最多可将56个18 x 18位嵌入式乘法器配置为两个独立的9 x 9位乘法器
- 每个器件提供4个PLL,提供时钟乘法和相移
- 高速差分I / O标准支持,包括LVDS,RSDS,mini-LVDS,LVPECL
- SSTL,SSTL-II IO标准,支持DDR,DDR2
- 单端I / O标准支持,包括3.3V,2.5V,1.8V和1.5V LVCMOS和LVTTL
- 通用封装选项LQFP-144,-176和FBGA-256
- 两个12位SarADC(嵌入式温度传感器)
- 通过JTAG和SPI接口进行灵活的设备配置
- 支持远程更新,通过“双重启动”之类的实现
- 支持片上信号调试
AG16KSDE176 / AG16KSDF256 / AG16KSDE176G器件是AG16K FPGA绑定的64MBit 32位166MHz SDRAM: -AG16KSDE176,QFP-176纸浆支持2层PCB(降低成本)设计。AG16KSDE176与AG10KSDE176引脚对引脚兼容。 -AG16KSDF256,FBGA-256封装支持152个用户IO和3个其他ADC IO。 -AG16KSDE176G,QFP-176封装支持2层PCB(低成本)设计,具有139个用户IO。
AG16KDDF256器件是AG128K FPGA,结合了128MBits 16位200MHz DDR-SDRAM,FBGA-256封装支持170个用户IO。
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